Funding · AI & Deep Tech

Sensesemi raises ₹25 crore seed round

By Startup Enthusiast · 21 January 2026

What they do

Sensesemi builds edge-AI chips for industrial IoT, automotive and medical devices

It raised ₹25 crore ($2.75M) in seed funding led by Piper Serica

The company plans its first chip tape-out in Q1 2026 and commercial production by Q1 2027

Sensesemi Technologies has raised ₹25 crore (about $2.75 million) in a seed round.
The round was led by Piper Serica, a venture capital firm.
Participating investors include LetsVenture Angel Fund, Sun Icon Ventures, MyAsiaVC, Whitepine Investments, and Jain Oncor.
Angel investors REAN Foundation, Niraj Shah, and Deepak Khanna also joined the round.
The company is DLI-approved under the Design Linked Incentive scheme of the India Semiconductor Mission.
The funds will be used for chip tape-outs, reference design creation, engineering team expansion, and strategic partnerships.
Sensesemi plans to work with TSMC as its fab partner and outsource testing and packaging to domestic OSAT players like Kaynes Technologies.

Indian semiconductor startups raised about $50 million in 2025, up 89% from $28 million in 2024.
The government approved four new semiconductor projects worth ₹4,584 crore under the India Semiconductor Mission.
The global edge-AI chipset market is projected to reach 5–7 billion units annually by 2030.
The India semiconductor market is expected to cross $100 billion by 2030.

Sensesemi is a fabless semiconductor startup (it designs chips but does not manufacture them itself).
It builds integrated edge-AI SoCs (system-on-chips) that combine AI inferencing, wireless mesh connectivity, and precision analog signal processing on a single chip.
Target sectors include industrial IoT, automotive, and medical devices.
Applications include predictive maintenance, vision-based quality checks, environmental monitoring, multi-sensor ADAS, driver monitoring, predictive diagnostics, cardiac monitoring, neurostimulation, and smart drug delivery.
The company is also developing an analog AI inference processor for battery-operated and implantable devices.

First chip tape-out planned for Q1 2026.
Second test chip planned for Q3 2026.
Commercial production targeted for Q1 2027.
Funds will be used for chip tape-outs, reference design creation, engineering team expansion, and strategic partnerships with device manufacturers and ODMs.
Exploring partnerships with Kaynes Technologies for testing and packaging in India.

Piper Serica (lead) — A venture capital firm; founder and fund manager Abhay Agarwal commented on the investment.
LetsVenture Angel Fund (participated)
Sun Icon Ventures (participated)
MyAsiaVC (participated)
Whitepine Investments (participated)
Jain Oncor (participated)
REAN Foundation (angel)
Niraj Shah (angel)
Deepak Khanna (angel)

Product: approved fabless semiconductor startup
Customers: Device manufacturers and original design manufacturers building industrial IoT, automotive, and medical hardware.
How it makes money: Sells proprietary semiconductor chips and licenses silicon design intellectual property.
What sets it apart: Integrates AI inferencing, wireless mesh connectivity, and precision analog sensing onto a single ultra-low-power chip.